Line up of Products
-
GTS-STD / GTS-MP
Foil for the general useOur typical surface treatment, having the excellent adhesion strength, which is applicable to the various resin base materials.
(GTS-MP is manufactured in Taiwan.)- Multi-layer wiring board
- High-density and multi-layer wiring board
- Build up wiring board
- Large-current substrate
-
DGTSEU2-MP
For high-frequency circuit substrate
Reverse side treatment foil（RTF）Excellent in high-frequency response, while low cost, by applying the roughening treatment on the smooth shiny surface.
(Manufactured in Taiwan)- Information communication equipment such as the router and the server
-
F-WS
Roughened foil (VLP)Excellent in the resin adhesion and in the circuit linearity by applying the uniform and dense roughening treatment.
- Flexible substrate
- Package substrate
-
FV-WS / FHG-WS
for high-frequency circuit substrate
Fine-roughened foil（H-VLP）By applying the fine-roughening treatment, both the resin adhesion and the high-frequency response, which are in the trade off relation, are at high levels.
- Information communication equipment such as the high-end router and the server.
- Substrate for an antenna in a communication base station
-
FZ-WS
For high-frequency circuit substrate
Ultra micro-roughened foil (H-VLP2)The industry's top level of low transmission loss is achieved by pursuing the further low-profiling while maintaining the same level of the adhesion as H-VLP.
- Information communication equipment such as the high-end router and the server.
- Substrate for an antenna in a communication base station
- Substrate for the millimeter wave radar
-
FWL-WS（VLP）
LCP compatible foilHigh adhesion is achieved even to hard base materials such as LCP.
- Liquid crystal polymer resin base material
- Package substrate
-
FT-UP
For high-frequency circuit substrate
Fine-roughened foil（VLP, H-VLP）high-frequency response in the level of VLP and H-VLP is achieved, while low cost. (Manufactured in Taiwan)
- Flexible substrate
- Information communication equipment such as the router and the server.
-
DF-TSH
High strength thin foil (VLP)The fine pattern with the thinness of the thinnest 6 μm is possible, and the high strength foil makes the handling performance excellent.
- Package substrate
- High-density multi-layer circuit board
Foil types and application examples
High-frequency compatible copper foil
Using our own unique surface treatment technology, the copper foil with reduced transmission loss in the high-frequency range was developed by suppressing the surface roughness to the utmost limit, and it supports the performance improvement and the stabilization of the high-speed data communication.
