Excellent in the resin adhesion and in the circuit linearity by applying the uniform and dense roughening treatment.

In the F-WS series, multiple types are lineup according to the roughening treatment level, and the adhesion with resin base materials, such as FPC, a package or rigid substrate, in any applications.

Feature

  • The low roughening treatment, capable of a fine pattern, is also excellent in the adhesion.
  • Recognized in the global market as the electrodeposited copper foil for the two-layered FPC, and it boasts trust and achievements.
  • The width in meters is available.

Typical application

  • Flexible substrate
  • Package substrate

Specification

F0-WS

Foil thickness [µm] 12

18

35

Tensile strength [MPa] 310 310 310
Elongation [%] 7 9 19
Surface roughness Rz [μm] 1.4 1.2 1.2

F2-WS

Foil thickness [µm] 9

12

18

35
Tensile strength [MPa] 310 310 310 310
Elongation [%] 4 7 9 19
Surface roughness Rz [μm] 1.8 1.8 1.8 1.3

F3-WS

Foil thickness [µm] 12 70
Tensile strength [MPa] 310 310
Elongation [%] 7 29
Surface roughness Rz [μm] 3.1 2.6

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105~
High-frequency substrate RTF Taiwan        
VLP Taiwan          
H-VLP Taiwan          
H-VLP Japan        
H-VLP2 Japan        
Flexible printed circuit boards VLP Japan      
VLP Japan          
VLP Japan          
Package substrate Standard foil Taiwan      
VLP Japan          
VLP Japan          
High-density multi-layer circuit board Standard foil Taiwan      
VLP Japan          
Large-current substrate Standard foil Japan             ○(~210μm)