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Sharp nodule foil

FWL-WS Copper Foil

Features

  • FWL-WS shows good adhesion to LCP that excel to high-frequency performance.
  • FWL-WS is good for fine-patterned semiconductor package PCB materials.

Application

  • High-frequency printed wiring board
  • Package substrate material
  • Fine-patterned printed wiring board

Specifications

Item Thickness [µm]
12 18
Unit Weight [g/m2] 107 153
Tensile Strength [N/mm2] RT 310
180°C 180
Elongation [%] RT 7 10
180°C 12 14
Surface Roughness [µm] Rz 2.1
Ra 0.33

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