High adhesion is achieved even to hard base materials such as LCP.

Feature

  • Provides high adhesion strength for liquid crystal polymer (LCP) backing layers, which offer superior high-frequency characteristics.

Typical application

  • Liquid crystal polymer resin base material
  • Package substrate

Specification

Foil thickness [µm] 12

18

Tensile strength [MPa] 310 310
Elongation [%] 7 9
Surface roughness Rz [µm] 2.3 2.0

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105~
High-frequency substrate RTF Taiwan        
VLP Taiwan          
H-VLP Taiwan          
H-VLP Japan        
H-VLP2 Japan        
Flexible printed circuit boards VLP Japan      
VLP Japan          
VLP Japan          
Package substrate Standard foil Taiwan      
VLP Japan          
VLP Japan          
High-density multi-layer circuit board Standard foil Taiwan      
VLP Japan          
Large-current substrate Standard foil Japan             ○(~210μm)