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Standard foil

GTS-STD, GTS-MP Copper Foil for large current circuit board

Outline

GTS copper foil is highly reliable a single-side treated copper foil for high-density PCB.

We developed GTS-STD and GTS-MP copper foil using our advanced foil manufacturing technology and surface treatment technology. GTS-STD and GTS-MP has great market share and good reputation in the field of high density multilayer printed circuit boards for train and automobile by its excellent adhesion and reliability.

Features

  • GTS-STD
    General purpose copper foil that correspond to Grade 1 in IPC-4562.
  • GTS-MP
    Middle surface roughness copper foil that correspond to Grade 2 and 3 in IPC-4562.

Use application

  • Multi-layered PCB
  • High density multi-layered wiring board
  • Build up PCB
  • 3layered flexible PCB

Surface Treatment

Surface Treatment

Specification

GTS-STD

Item
Foil Thickness [µm]
9 12 18 35 105 140 175 210
Unit Weight [g/m2] 81 108 153 285 900 1190 1500 1830
Tensile Strength
[N/mm2]
RT
350 340 330 320 280 280 275 270
180°C 170 170 170 170 150 150 155 150
Elongation [%] RT
4 6 7 17 12 13 14 14
180°C 3 3 3 3 3 3 3 3
Surface Roughness
[µm]
Matte side (Rz) 6 8 9 10 14 15 16 16
Shiny side (Ra) 0.3 0.3 0.3 0.3 0.3 0.3 0.3 0.3
Shiny side (Rz) 2 2 2 2 2 2 2 2
Peel Strength
[kN/m]
(v.s. FR-4)
Normal state (A) 1.1 1.3 1.6 2.3 3.5 4.0 4.2 4.2
After soldering (S4) 1.1 1.3 1.6 2.3 3.5 4.0 4.2 4.2
After heat treatment(E-1/125) 0.7 0.9 1.4 2.1 3.4 3.9 4.1 4.1
Rate of Strength Decrease [%]
(v.s. FR-4)
After hydrochloric acid treatment
(12%HCl/30min)
1 1 1 2 3 3 3 3
After boiling test
(D-2/100)
2 2 3 5 6 6 6 6

GTS-MP

Item Foil Thickness [µm]
12 18 35
Unit weight [g/m2] 108 153 285
Tensile Strength
[N/mm2]
RT
330 320 300
180°C 170 170 170
Elongation [%] RT
7 10 21
180°C 10 9 11
Surface Roughness
[µm]
Matte side (Rz) 7 8 9
Shiny side (Ra) 0.3 0.3 0.3
Shiny side (Rz) 2 2 2
Peel Strength
[kN/m]
(v.s. FR-4)
Normal state (A) 1.2 1.5 2.0
After soldering (S4) 1.2 1.5 2.0
After heat treatment (E-1/125) 0.8 1.4 1.9
Rate of Strength Decrease [%]
(v.s. FR-4)
After hydrochloric acid treatment
(12%HCl/30min)
1 1 2
After boiling test
(D-2/100)
2 3 4

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