Based on its long-fostered material technology and combining advanced technologies of material processing and heat managing, Furukawa Electric is engaged in the research and development of various components and equipment for electronics and mounting technologies, as well as wiring materials and heat-sinks for electronic equipment. Taking steady aim at the field of semiconductor industries where trends for high density and high precision are accelerating, we will continue to provide new products and new technologies.
| Major R&D Items |
- Aluminum substrate printed circuit boards, High-power circuit boards, Copper paste for component mounting, Contact materials, Connectors
- Aluminum memory disks
- Plastic materials for electronics: UV curable adhesive tapes for semiconductor, Adhesive sheet with high thermal conductance, Heat-shrinkable tubes
- Heat dissipation and cooling technology: Heat pipes, Heat sinks, Heat-dissipating substrates
- Wiring materials and winding wires for electronics: Triple insulated winding wires, Heat-resistant wires
- Compact antennas: for Cellular phones of next generation, for GPS, etc.
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| Location of R&D Activities |
- Ecology & Electronics Laboratories
- Metal Research Center
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Heat pipe
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