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UV-Tape for BGA/CSP Package Dicing

FC-Series

A new innovative adhesive tape for BGA/CSP package dicing.

  • No Package Flying!
  • Applicable to Low Illumination Lamp!

Features

  1. High tuck strength avoids package flying during dicing.
  2. Characteristics of near zero adhesion after UV irradiation makes it possible to pick up diced package easily.
  3. No peeling of lnk Marking.
  4. No adhesive residue in the laser marking area.

The above are typical charactristics, and should not be used for any specification purpose. Properties and characteristics are different between kinds and types. Please contact us for the details of the respective tapes.

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