Die Attach Film is adhesive film which is used for semiconductor process.

It is combined with dicing tape, and it is called as Dicing Die Attach Film.

Feature

Characteristics (Main Products)

DAF Type AFN301 AFN303 AFN601
Curing Condition 150deg.C×1h 150deg.C×1h

120deg.C×1h or

140deg.C×0.5h

DAF thickness µm 20 10 50/60/80
General DC tape Type UV type
“K13”
UV type
“K13”
UV type
“K13”
DC tape thickness µm 100 100 100
Recommended UV dosage mJ/cm2 200 200 200
CTE αrpha1 ppm/K 36 33 25
αrpha2 ppm/K 125 121 70
Tg (TMA) deg.C 110 120 160
Metling Viscosity 60deg.C Pa・s 120000 50000 16500
120deg.C Pa・s 1900 1500 690
150deg.C Pa・s 300 500 600
Elastic Modulus 25deg.C MPa 5600 5000 7100
100deg.C MPa 4800 4100 6200
150deg.C MPa 180 250 5100
200deg.C MPa 60 135 2000
250deg.C MPa 54 146 730
Die Shear Strength @24deg.C MPa 55 74 34
@260deg.C MPa 29 14 8

(note) Data should be considered representative or typical only and should not be used for specification purposes.

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