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What is UV-Tape?

Comparison between UV Tape and Conventional Tape
Comparison between UV Tape and Conventional Tape

UV-tapes is adhesive tapes that have strong adhesive strength, and characteristic that adhesive strength becoming very small after UV irradiation.

UV-tapes can settle the wafers surely with the strong adhesive strength in the wafer dicing or grinding.
After UV irradiation, tapes are easy to be peeled off from the wafer in picking-up or delamination process.

Thus, our UV-tapes can improve the quality and save cost, of semiconductor processing.

Applications of UV-TAPES in semiconductor processing

Backgrinding(or Etching)

Backgrinding(or Etching)

This process is finishing of the back side of the wafer.

Backgrinding is machinery processing, and Etching is chemical processing , of the back side of the wafer.

UV-TAPE is used for protect of the surface of the wafer, from shock and vibration of backgrinding, or acid etchants.


This process requires these properties to UV-TAPE.
Before UV irradiation High Adhesion (to guard the surface of the wafer)
Shock and Vibration Absorption (to protect the wafer against breakage and damage during backgrinding)
Acid Resistance (to protect the wafer from acid etchants)
After UV irradiation Easy peeling-off (no stress during tape removal)
no contamination (on the surface after the tape removed)

Dicing

Dicing

Numbers of Integrated Circuits formed on the wafer is accurately diced into a individual IC.

In this process, wafer is mounted by UV-TAPE.


This process requires these properties to UV-TAPE.
Before UV irradiation High Adhesion(to protect the wafer against chip flying)
After UV irradiation Easy peeling-off (no stress during tape removal)
no contamination (on the surface after the tape removed)

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