Production | Alloy system | Chemical composition | Features | Example of use |
---|---|---|---|---|
Cu-Mn-Ni | Cu-11.5Mn-2.7Ni | Low temperature coefficient of resistance (TCR) and low thermal electromotive force (EMF). |
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Cu-Mn-Sn | Cu-6.8Mn-2.3Sn | Low temperature coefficient of resistance (TCR) and low thermal electromotive force (EMF). |
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OFC (C1011) |
Oxygen free copper for electron devices | 99.99Cu | The first to obtained JIS Third-party Certificate in Japan. |
|
OFC (C1020) |
Oxygen free copper | 99.96Cu | The highest level in purity. |
|
TPC (C1100) |
Tough pitch copper | 99.90Cu | The highest level in purity. |
|
CC Bar (C18200) |
Cu-Cr | Cu-0.9Cr | High strength, high conductivity and excellent heat resistance. |
|
CZ Bar (Substitute to C15000) |
Cu-Zr | Cu-0.2Zr | High strength, high conductivity and excellent heat resistance. |
|
CZC61 Bar (C18150) |
Cu-Cr-Zr | Cu-0.6Cr-0.1Zr | High strength, high conductivity and excellent heat resistance. |
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EFTEC-194BD (C19400) |
Cu-Fe | Cu-2.4Fe-0.13Zn-0.04P | High strength, high conductivity, good bendability and good heat resistance. |
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EFTEC-98BD | Corson copper | Cu-3.75Ni-0.9Si-0.5Zn-0.15Sn-0.1Mg | Good strength, high conductivity and excellent stress relaxation property. |
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Resistance alloys | Cu-Ni, Cu-Zn, Other | Cu-Ni, Cu-Zn, Other | High strength, high conductivity and excellent heat resistance. |
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