Satoru Torimitsu, Takahiro Saito
Abstract
Pursuant to a higher transmission speed with an increase of the information amount such as Internet of Things (IoT) or big data, a higher frequency band than the microwave band becomes used. The printed circuit board (PCB) which forms apparatuses/ products requires low-loss materials in the high-frequency band. In this article, we describe the manufacturing process and the feature of our electro-deposited copper foil, and also explain, based on an actual case, how to model and utilize the electro-deposited copper foil in a high frequency characteristic simulation which is essential for the design and the development of electronic devices.
Contact for inquiries about Furukawa Electric Review