Introduction of New Product, New Technology, and Technical Data
New Product, New Technology
-
Electrically/thermally conductive
dicing die attach filmOur conductive dicing die attach film has electrical/thermal conductivity to resolve issues with packages, which continue to become thinner and more compact.
-
For silicon, glass, and mold resin
Dicing tapeTape suitable for dicing a wide range of adherends.
-
For protection/transfer processes
UV tapeTape for temporary retention and transport between processes.
-
For laser process
Transparent tapeTape with high transmittance and dicing performance. -
For silicon, GaN, and sapphire
Back-grinding tapeBack-grinding tape that supports a wide variety of wafer types. -
For SDBG/GAL processes
Back-grinding tapeOur back-grinding tape for SDBG/GAL processes allows ultrathin wafers to be processed into chips with high quality and high yield.
-
For wafer with solder bumping
Back-grinding tapeBack-grinding tape that supports wafers with bumps up to 250 μm in height.
-
For etching tape/acid, heat process
Surface protection tapeTape suitable for protecting wafer surfaces during acid etching and heating processes.
Technical Data
-
What is UV Tape ?
UV tape have strong adhesive strength. Then, tape holds wafer strongly in wafer grinding process or wafer dicing process.