Masaru Oomi , Toshiro Fukumoto , Takao Kobayashi , Masanobu Sugiura , Katsuo Nakayama , Ken'ichi Namba
In recent years, the heat produced in notebook PCs has increased rapidly along with the upgraded speed of the MPU, making heat dissipation measures thereof indispensable. Micro heat-pipe heat-sinks which are capable of dealing with this problem have been in practical use since 1995. Conventional heat-sinks, however, can no longer provide sufficient cooling for the latest version of MPUs in notebook PCs where increased heat production is seen caused by high-performance peripheral components. This paper reports on the technological background of micro heat-pipe heat-sinks for notebook PCs together with fin-composite micro heat-pipe heat-sinks that are expected to dominate the field of heat-sinks of the next generation.