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Furukawa Review No.21

Development of a New Solder Paste Printer

Nobuyuki Yamamoto , Hideaki Fujii , Toshiya Hikami , Yoshinori Nakamura

Abstract

Recent years have seen an explosive dissemination of cellular telephones, personal digital assistants (PDAs) and other types of hand-held information terminals. This has led to increased use of surface mounted components--ball grid arrays (BGAs), chip scale packages (CSPs) and microcomponents like the 0603 chip, which are difficult to inspect or repair once they have been mounted, and this in turn means greater demand for solder paste printers that offer greater accuracy and higher speed. Accordingly the authors have developed a new type of solder paste printer, offering the same high rigidity and higher alignment accuracy as Furukawa Electric's currently used model, together with a new squeegee unit that offers stable printing irrespective of printing speed and an alignment system capable of simultaneous detection of stencil and board.

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Bound to Innovate

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