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Furukawa Review No.25

New Evaluation Methods for Pressure Sensitive Adhesive (PSA) Tapes Used in the Semiconductor Industry

Tomoyuki Aogaki, Hidefumi Miyagi and Yoshihisa Kano

Abstract

We propose new evaluation methods for pressure sensitive adhesive (PSA) tapes using a high-resolution tester for shearing adhesion and a pendulum-type mechanical apparatus, by means of which we can evaluate the mechanical properties of the pressure sensitive adhesion (PSA) layer, and of products, in the form of PSA tapes. Using these methods we evaluated the adhesion of a blend of acrylate copolymer with UV-curable urethane acrylate oligomer, and two kinds of UV-curable acrylate copolymers. The high-resolution tester for shearing adhesion made it possible to clarify differences in the properties of PSA tape that cannot be evaluated by the usual methods, and the pendulum-type mechanical apparatus made it possible to detect differences in the mechanical properties of adhesion before and after UV irradiation. We expect that these methods will clarify the relations between the practical properties and mechanical properties of PSA tapes utilized in the semiconductor industry, and will prove useful to the design and quality control of PSA tape.

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