Takeshi Hirasawa, Kenya Kawabata and Masaru Oomi
The environment around heatsinks is increasing in severity day by day. It is known that the heat generated by electronic devices continues to increase, while the casing is becoming more compact. Moreover, there is an urgent requirement for addressing environmental issues including weight reduction and elimination of environmentally hazardous substances. This paper presents the manufacturing technologies for heatsinks that have been developed in response to such requirements together with the heatpipe products using such technologies.