Kazuo Yoshida , Shuichi Kitagawa , Kengo Mitose , Kyota Susai
Abstract
As a matter of consideration of plating materials for automobile terminals, we made a sample in which a Cu-Sn diffusion layer was exposed to the surface. We evaluated its anti-fretting characteristics, its corrosion resistance, its coefficient of friction, its solder wettability. As a result, when compared to the conventional plating materials with Sn on its surfaces, the material with the Cu-Sn diffusion layer (Cu-Sn alloy plating) showed much superior anti-fretting characteristics. Also, it met or exceeded its capabilities of coefficient of friction and corrosion resistance has sufficient performance for practical use. Its solder wettability was a little inferior to the conventional ones, though.
Full Text PDF(1,063KB)
