Start of page

Telecommunications Menu starts

Telecommunications Menu ends

Main Content starts

Sharp nodule foil

FWL-WS Copper Foil


  • FWL-WS shows good adhesion to LCP that excel to high-frequency performance.
  • FWL-WS is good for fine-patterned semiconductor package PCB materials.


  • High-frequency printed wiring board
  • Package substrate material
  • Fine-patterned printed wiring board


Item Thickness [µm]
12 18
Unit Weight [g/m2] 107 153
Tensile Strength [N/mm2] RT 310
180°C 180
Elongation [%] RT 7 10
180°C 12 14
Surface Roughness [µm] Rz 2.1
Ra 0.33

Top of Page

Sub Category Menu starts

Sub Category Menu ends

Bound to Innovate

End of page