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Low profile foil

F-WS Copper Foil for FPC

Outline

F-WS is the most suitable copper foil for advanced printed wiring boards. F-WS provides good flexibility and very low anisotropy because of its microscopic grain structure. F-WS shows good heat and chemical resistance, high adhesion to almost all resin materials because of our unique surface treatment technology.

Features

  • Microscopic grain structure of F-WS contributes very good flexibility and even equal to rolled copper foil.
  • Very low-profile surface treatment is suit for fine pitch patterning of high-end PCB and is designed for good performance in adhesion.
  • F-WS account for large domestic share in the market of two-layered FPC for COF.
  • Adopted as high functionality circuit board material for smartphone and tablet PC.
  • Could be offered in 1000 mm width.

Use application

  • Flexible Printed Circuit Board

Specifications

F0-WS

Item Thickness [µm]
9 12 18
Unit Weight [g/m2] 81 107 153
Tensile Strength [N/mm2] RT 310
180°C 180
Elongation [%] RT 5 7 10
180°C - 12 14
Surface Roughness (Rz) [µm] Matte side 1.5
Shiny side 1.6
Peel Strength [kN/m] FR-4 -
PI -

F1-WS

Item Thickness [µm]
9 12 18
Unit Weight [g/m2] 81 107 153
Tensile Strength [N/mm2] RT 310
180°C 180
Elongation [%] RT 5 7 10
180°C - 12 14
Surface Roughness (Rz) [µm] Matte side 1.9
Shiny side 1.6
Peel Strength [kN/m] FR-4 -
PI -

F2-WS

Item Thickness [µm]
9 12 18
Unit Weight [g/m2] 81 107 153
Tensile Strength [N/mm2] RT 310
180°C 180
Elongation [%] RT 5 7 10
180°C - 12 14
Surface Roughness (Rz) [µm] Matte side 2.1
Shiny side 1.6
Peel Strength [kN/m] FR-4 0.8 0.9 1.0
PI 0.7 0.8 0.9

F3-WS

Item Thickness [µm]
12 18
Unit Weight [g/m2] 107 153
Tensile Strength [N/mm2] RT 310
180°C 180
Elongation [%] RT 7 10
180°C 12 14
Surface Roughness (Rz) [µm] Matte side 2.6
Shiny side 1.6
Peel Strength [kN/m] FR-4 1.0 1.1
PI 0.9 1.0

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