Furukawa Electric Review No.51Analysis of Deformation Twin and Mechanical Strength Using Simulation Model in the Deformation Microstructure of Copper Alloy

Hidemichi Fujiwara, Hiroshi Kaneko

Recently, the compatibility of the strength, the workability, and the high conductivity are needed in copper alloy materials which are produced by controlling the combined process of the cold working and the aging treatment, in response to size reduction of electronic connectors and increase of the assembly density, and in improving the performance of electronic devices. Especially, in the solution hardening alloys, the microstructure change in cold working process becomes a very important factor, although the microstructure change behavior is extremely complex. In this report, the calculation model to evaluate the microstructure changes resulting from the introduction of dislocation, the creation of dislocation cell/substructure and the deformation twin, and the effect of the dynamic recovery in deformation processing, was proposed. And the microstructure change due to cold working processing was analyzed with this model regarding a relationship between a processing condition, the microstructure, and the flow stress. By applying evaluations to various Cu-Zn-Si system alloys which have different stacking fault energy, the validity of the calculation model was confirmed by comparing the experimental and the calculated results. And the concept of the microstructure control in the deformation twin creation based on results of this model calculation was summarized.