Data center solutions
With our technical strength in telecommunication, materials including heat diffusion, Furukawa Electric provides a wide range of products for data centers and solves the problems that our customers are facing.
News Release
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2023/3/2Development of a new pump laser for high output power, low power consumption Raman amplifiers by expanding the range of the FRL1441U Series to support the S-band and L-band - Start mass production from September 2023, and contribute to the realization of ultra-high speed, large volume networks -
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2023/3/2Presenting an 8-channel CWDM TOSA for CPO ELS employing a blind mate optical connector at OFC2023 - Realized a record low power consumption of 4.0 W operated with a fiber-coupled power of 100 mW/ch at a case temperature of 55℃ -
Data centers supporting high speed, large volume communication and cloud services
Data centers house IT equipments including servers, storage and network devices to process the data. The further evolution of data centers has made large volume data communication possible in our everyday life. In recent years, “hyperscale data centers” has been increasing to support the more widespread use of cloud services and even faster, larger volume data communication. Furukawa Electric supports wide range datacenters from enterprise data centers to hyperscale data centers through our technology of optical transmission, power transmission, functional materials in devices.
Data center solutions of Furukawa Electric
With our optical transmission, power cable and electronics technology, we provide a broad lineup of high reliable products for data centers and solve the problems our customers are facing.
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Optical transmission and connection solutions for hyperscalers
We provide easy-to-install, high density, high quality optical transmission and connection solutions, including the thin ultra-high count Rollable Ribbon optical cable which can install the world highest fiber counts in the limited spaces at one time, fusion splicers that can connect up to 16 Rollable Ribbon fibers simultaneously, and multi-fiber connectors which enables low loss and short time connection due to excellent dimensional accuracy.
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Lineup of optical fiber products optimized for particular applications
We contributes to connecting data centers around the world with a lineup of optical fiber products optimized to best suit each transmission distance and application including inter-continental, inter-city, access networks, and premises.
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Optical active devices supporting high-speed optical communication
Utilizing our accumulated semiconductor chip technology, Furukawa Electric has developed laser light sources for use in data centers and between data centers, including distributed feedback (DFB) laser light source integratable in silicon photonics (SiPh) devices and a tunable laser assembly (ITLA) for small transceiver, and through these products, we support high speed optical communication.
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Connectors for high current connections (with wrong insert prevention mechanism) and cables
By combining flexible, flame-resistant cable and easy to use connectors, we realize simple, easy and reliable on-site cable connection between lighting panels, power panels or bus ducts etc.
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Heat diffusion (thermal solutions)
In response to increasing heat generation from CPU or GPU triggered by the increased data traffic, we provide cooling solutions of high performance heat pipes and heat sinks.
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Firestop products (Flame retardant product)
We provide fire protection measures for cables and piping penetrating walls and floors that are easy to install and can be re-installed.
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Thermally / electrically conductive film for semiconductor
Developed using our polymer mixing and sheet manufacturing technologies, our electrically/thermally conductive die attach film is mixed with a special filler and continues to attract attention as a means to solve issues with heat dissipation in packages for 5G/IoT applications.
Electrically/thermally conductive dicing die attach film product
Product lineup
Furukawa Electric offers a product lineup covering a wide range of data center applications. For more details, use the links provided below to view the individual product websites.
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Thin, ultra-high count Rollable Ribbon optical fiber cable
Thin and lightweight optical cable that reduces installation time through batch connection and realizes high density optical fiber assemblies.
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SZ-slotted core cable
A broad lineup of products is available for a wide range of applications and installation environments.
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Optical connector & cord
Single and multi fiber connector products which connects between racks and transmission devices.
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EZ!Fuse™ field installable fusion splice connector
Field installable connector that enables easy connections at the installation site. The pre-polished ferrule and fusion splicing realize low insertion loss and high return loss.
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Optical patch panel for 19 inch racks - Connector-tiltable adapter
Panel that can be mounted on a 19 inch rack indoors or in a data center and used for optical cable termination. It offers high density assemblies and excellent plugging/unplugging operability of SC or LC connectors.
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Optical termination box
Optical termination box equipped with fusion splicing and connector connections for ultra-high count cable.
Single mode fiber (For regional networks/access lines, indoor networks/service lines)
Multi-mode fiber (For campuses/buildings)
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FITELnet FX1
High performance router with encryption throughput up to 13Gbps. It has been extensively used in data center applications. (Japanese)
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FITELnet FX201
With encryption throughput up to 16Gbps, this high performance router is equipped with 36 1G/10G multi-rate ports. It has been extensively used in data center applications. (Japanese)
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FITELnet FX2
With encryption throughput up to 200Gbps, this high performance router supports QSFP+ and QSFP28 ports. It enables large volume DC interconnections. (Japanese)
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FITELnet vFX
With encryption throughput up to 80Gbps, this high performance virtual router functions on general purpose servers. (Japanese)
Digital coherent communications
Intensity Modulation Direct Detection (IMDD) communications
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DFB chip
High output, high reliability CW-DFB laser light source for silicon photonics (SiPh) devices. (DFB: Distributed feedback laser diode)
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EML
Modulator integrated semiconductor laser light source equipped with a semiconductor optical amplifier (SOA) that realizes high output (Chip on Carrier (CoC) structure).
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High current plug-in connector
High current plug-in connector is easy to insert and remove and with wrong insert prevention mechanism . It greatly contributes to increase safety and labor-saving at the installation site.
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Easy aluminum cable system
Easy aluminum cable is much lighter and more flexible than traditional copper cable. We offer the cable with the related accessories and tools. (Japanese)
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EM-FCC
Environmentally friendly halogen-free cable with excellent flexibility and small bending radius thus it is suitable for wiring in limited spaces. (Japanese)
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EM-LMFC
Environmentally friendly insulated wire with excellent heat resistance and large currency capacity. It is also flexible and good for the wiring rationalization.
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GOFCⓇ Oxygen-free copper for heat diffusion of power semiconductor substrates
Oxygen-free copper characterized by low Young's modulus and it can reduce chip peeling caused by thermal stress. The grain size can remain small, thus contributes to improve test reliability.
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EFTEC-64T Copper alloy for semiconductor leadframes
Copper alloy with low residual stress and excellent etchability. In addition, it does not contain iron, thus it is non-magnetic and suitable for use in sensors.
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EFCUBE Copper alloy for board-to-board connectors
Copper alloy with high strength and excellent bending workability. It is also superior in stress relaxation and contributes to getting connector smaller.
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EFTEC-550 Copper alloy for spring terminals
Copper alloy with high electrical conductivity and high stress relaxation resistance that can be used in high current applications. It is available in two types: strength-focused type and electrical conductivity focused type.
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Tape for Backgrinding
These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
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Tape for Dicing
These tapes are designed for holding semiconductor wafer or package during dicing process.
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Dicing Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process. It is combined with dicing tape, and it is called as Dicing Die Attach Film.
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Heat sink
High reliable heat sink which has a lot of supply records to the data centers. We provide a wide variation of products by customized design.
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Heat pipes
Heat transfer device using latent heat and the product provides excellent thermal conductivity, high reliability and maintenance free. The product realize the energy saving by increasing heat diffusion performance and reducing the use of fans.
Related links
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The Development of a Nano-ITLA for Digital Coherent Datacenter Interconnects (Furukawa Electric Review, No. 52)
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Ultra-high Fiber Count (UHFC) 6912-Fiber Cable With 200 μm 16-Fiber Rollable Ribbon, Ribbon Fiber Mass Fusion Splicer S124M16 and Related Tools (Furukawa Electric Review, No. 52)
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Development of Copper Short Fiber Wick Heat-pipe for Data Center (Furukawa Electric Review, No. 51)
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Business Field
Inquiries about data center solutions
