As the solution of heat release for small and thin package, we are developing conductive die attach film.
- It has more than 10W/m・K thermal conductivity
It achieves lower curing temperature which is below 150℃
Optimized UV dicing tape is attached, and it achieves good dicing & pick-up performance
In addition, it’s able to simulate thermal status of various package with simulation tools which installed in Furukawa Electric.
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