This tape is used to hold semiconductor wafer during dicing/singulation process.
Features
| Series | Adherend | Features | Suggested product numbers |
|---|---|---|---|
| UC Series (UV Type) |
Silicon wafers |
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| UC Series (UV Type) |
Glass, resin filters |
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| UC Series (UV Type) |
Compound wafer (ceramic, GaN, SiC, GaAs, etc.) |
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| FC Series (UV type) |
Mold resin packages (BGA/QFN/ETC) |
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Characteristics
UC Series for silicon wafers
| Tape | UC3044M-110E | UC3044M-110B | UC3139M-85 | UC-334EP-85 | ||
|---|---|---|---|---|---|---|
| Backing Film Thickness | 100 | 100 | 80 | 80 | ||
| Adhesive Thickness (µm) | 10 | 10 | 5 | 5 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 5.1 | 2.5 | 4.9 | 1.5 |
| After UV | 0.3 | 0.2 | 0.5 | 0.3 | ||
| Si-Wafer | Before UV | 1.8 | 1.1 | 2.2 | 1.1 | |
| After UV | 0.1 | 0.1 | 0.1 | 0.2 | ||
| Features | Less chipping | Less chipping | Suitable for thin wafers | Suitable for back side metal | ||
(note)Data shown above are typical values and not guaranteed values.
Application map
(note)Data shown above are typical values and not guaranteed values.
UC Series for glass and resin filters
| Tape | UC3145M-160 | UC3166M-115 | UC3160M-95 | UC3098M-110 | ||
|---|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 150 | 100 | 80 | 100 | ||
| Adhesive Thickness (µm) | 10 | 15 | 15 | 10 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 9.8 | 8.3 | 1.9 | 5.8 |
| After UV | 0.3 | 0.3 | 0.3 | 0.4 | ||
| Si-Wafer | Before UV | 9.2 | 8.3 | 0.5 | 2.3 | |
| After UV | 0.1 | 0.1 | 0.1 | 0.1 | ||
| Features | Less chipping | Suitable for blade dicing | Suitable for stealth dicing | Suitable for resin filters | ||
(note)Data shown above are typical values and not guaranteed values.
UC Series for Compound wafer (ceramic, GaN, SiC, GaAs, etc.)
| Tape | UC-120M-120 | UC3166M-115 | UC3160M-95 | UC-334EP-85 | UC-228W-110 | ||
|---|---|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 100 | 100 | 80 | 80 | 70 | ||
| Adhesive Thickness (µm) | 20 | 15 | 15 | 5 | 20+20 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 12.6 | 8.3 | 1.9 | 1.5 | 10.9 |
| After UV | 0.2 | 0.3 | 0.3 | 0.3 | 0.2 | ||
| Si-Wafer | Before UV | 7.5 | 8.3 | 0.5 | 1.1 | 3.1 | |
| After UV | 0.1 | 0.1 | 0.1 | 0.2 | 0.1 | ||
| Features | Less chipping | Less chipping | Less chipping | Suitable for wafers with metal | Double-sided adhesive type | ||
(note)Data shown above are typical values and not guaranteed values.
FC Series for mold resin packages (BGA/QFN/ETC)
| Tape | FC2127M-165 | FC-224M-170 | FS-8304-170 | ||
|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 150 | 150 | 150 | ||
| Adhesive Thickness (µm) | 15 | 20 | 20 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 8.3 | 6.1 | 4.9 |
| After UV | 0.7 | 0.4 | 0.5 | ||
| Si-Wafer | Before UV | 8.9 | 5.2 | 5.5 | |
| After UV | 0.5 | 0.3 | 0.3 | ||
| Features | Suitable for small-sized package | Less/no whisker | Antistatic | ||
(note)Data shown above are typical values and not guaranteed values.
Applications
Wafer dicing process
PKG dicing process
Glass dicing and transfer process
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