This protection tape has high resistance on acid and heat process.
Features
- No seepage, high acid resisting
- Bear with 150℃ TEMP
Characteristics
Protection tape for acid
| Tape | SP-594M-130 | SP-537T-160 | CP9003B-205B | ||
|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 100 | 100 | 165 | ||
| Adhesive Thickness (µm) | 30 | 60 | 40 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 7.9 | 4.1 | 1.8 |
| After UV | 0.1 | 1.0 | - | ||
| Si-Wafer | Before UV | 3.0 | 1.5 | NA | |
| After UV | 0.1 | 0.1 | - | ||
| Features |
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(note)Data shown above are typical values and not guaranteed values.
Heat process
| Tape | SP6002T-115 | SP6101T-40 | ||
|---|---|---|---|---|
| Backing Film Thickness (µm) | 75 | 25 | ||
| Adhesive Thickness (µm) | 40 | 15 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 6.0 | 1.4 |
| After UV | 0.3 | 0.1 | ||
| Si-Wafer | Before UV | 2.5 | 1.1 | |
| After UV | 0.1 | 0.1 | ||
| Features |
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(note) Does not support back-grinding processes |
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(note)Data shown above are typical values and not guaranteed values.
Process
Change in adhesive strength due to heat
Good stability in heat process.
(note)Data shown above are typical values and not guaranteed values.
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