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For silicon, GaN, and sapphire
Back-grinding tape

This is protection tape for circuit of semiconductor wafer surface in back grinding process.

Features

Suitable for thin wafer grinding caused by stress relaxation
Good for detaping
Suitable for various device

Series	Adherend	Features	Suggested product numbers
SP Series	Silicon wafers	Thin wafer Less warpage Less adhesion Coverage up to 60μm Coverage up to 250μm	SP-594M-130 SP5156B-130 SP-541B-205 SP-537T-230 SP5207M-425
SP Series	Special applications (SiC, GaAs, GaN, sapphire, etc.)	High-rigidity substrate	SP-537T-130 SP-537T-160 SP-594M-130
CP Series	Silicon wafers	Thin wafer Coverage up to 20μm Silicone-free Coverage up to 250μm	CP9007B-130 CP9003B-205B CP9079B-200 CP9206M-430

Characteristics

SP Series for silicon wafers

Tape			SP-594M- 130	SP5156B- 130	SP-541B- 205	SP-537T- 230	SP5207M- 425
Backing Film Thickness (µm)			100	110	165	100	420
Adhesive Thickness (µm)			30	20	40	130	5
Adhesive Strength (N/25mm)	♯280-SUS	Before UV	7.9	1.3	2.6	6.4	0.4
	♯280-SUS	After UV	0.1	0.3	0.5	0.8	0.3
	Si-Wafer	Before UV	3.0	0.5	1.7	2.5	0.2
	Si-Wafer	After UV	0.1	0.1	0.2	0.1	0.1
Features			Suitable for thin wafer Suitable for etching UV Type	Suitable for thin wafer Less warpage Easier detaping strength UV Type	Suitable for thin wafer Less warpage UV Type	Coverage up to 60μm UV Type	Coverage up to 250μm UV Type

(note)Data shown above are typical values and not guaranteed values.

SP Series for Compound wafer (SiC, GaAs, GaN, sapphire, etc.)

Tape			SP-594M-130	SP-537T-160
Backing Film Thickness (µm)			100	100
Adhesive Thickness (µm)			30	60
Adhesive Strength (N/25mm)	♯280-SUS	Before UV	7.9	4.1
	♯280-SUS	After UV	0.1	1.0
	Si-Wafer	Before UV	3.0	1.5
	Si-Wafer	After UV	0.1	0.1
Features			High-rigidity substrate Suitable for etching UV Type	High-rigidity substrate Support coverage UV Type

(note)Data shown above are typical values and not guaranteed values.

CP Series for silicon wafers

Tape		CP9007B-130	CP9003B-205B	CP9079B-200	CP9206M-430
Backing Film Thickness (µm)		100	165	165	420
Adhesive Thickness (µm)		30	40	35	10
Adhesive Strength (N/25mm)	♯280- SUS	0.9	1.8	0.5	0.3
Features		Non-UV Type	Coverage up to 20μm Suitable for thin wafer Acid etching Non-UV Type	Silicone Free Release Film Non-UV Type	Coverage up to 250μm Non-UV Type

(note)Data shown above are typical values and not guaranteed values.

Process

SP Series: Application map

(note)Data shown above are typical values and not guaranteed values.

CP Series: Application map

(note)Data shown above are typical values and not guaranteed values.

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