These tapes are designed for surface protection of semiconductor wafers during backgrinding process.

Feature

Line up of Tape for Backgrinding

Tape SP Series CP Series
Features UV Type Non-UV Type
Release Film PET PET
Polypropylene
Adhesive Acrylic Acrylic
Backing Film Polyolefin Polyolefin

Characteristics (Main Products)

SP Series

Tape SP-594M-130 SP-537T-130 SP-541B-205 SP5156B-130
Backing Film Thickness (µm) 100 100 165 110
Adhesive Thickness (µm) 30 30 40 20
Adhesive Strength (N/25mm) ♯280-SUS Before UV 8.6 4.1 2.7 1.4
After UV 0.1 1.6 0.5 0.4
Si-Wafer Before UV 3.3 1.7 1.6 0.6
After UV 0.1 0.1 0.2 0.1
Tensile Strength
(N/10mm)
MD 23 18 26 21
TD 22 16 23 17
Elongation
(%)
MD 800 550 430 450
TD 930 690 570 620
Features
  • Standard
  • Etching-Durable
  • Standard
  • For Sapphire Wafer
  • Low Warpage
  • For Thin Wafer
    (>100µm)
  • Low Warpage
  • For Thin Wafer
    (>75µm)

(note) Data should be considered representative or typical only and should not be used for specification purposes.

CP Series

Tape CP9007B-130 CP9003B-205B CP9079B-200 CP9134M-130
Backing Film Thickness (µm) 100 165 165 100
Adhesive Thickness (µm) 30 40 35 30
Adhesive
Strength
(N/25mm)
♯280-SUS 0.9 1.8 0.6 1.7
Si-Wafer 0.7 1.6 0.4 1.2
Tensile Strength
(N/10mm)
MD 21 44 34 28
TD 19 34 36 20
Elongation
(%)
MD 550 600 500 490
TD 710 710 690 730
Features
  • Standard
  • Excellent Absorbing Property of Roughness
  • Recommending of Heat De-Taping
  • Low Residue
  • Low Warpage
  • For Thin Wafer (>100µm)

(note) Data should be considered representative or typical only and should not be used for specification purposes.

There line-up is typical product.

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