These tapes are designed for holding semiconductor wafer or package during dicing process.

Feature

Line up of Tape for Dicing

Tape Wafer Dicing
UC Series
Package Dicing
FC Series
Features UV Type UV Type
Release Film PET

PET

Adhesive Acrylic Acrylic
Backing Film Polyolefin Polyolefin

Characteristics (Main Products)

UC series for wafer dicing

Tape UC-353EP-110A UC3026M-110 UC3044M-110B UC-334EP-85
Backing Film Thickness (µm) 100 100 100 80
Adhesive Thickness (µm) 10 10 10 5
Adhesive Strength (N/25mm) ♯280-SUS Before UV 7.1 5.0 2.7 2.2
After UV 0.4 0.5 0.2 0.3
Si-Wafer Before UV 2.7 1.6 1.2 1.1
After UV 0.1 0.1 0.1 0.2
Tensile Strength (N/10mm) MD 49 26 41 22
TD 44 26 39 18
Elongation (%) MD 750 310 740 360
TD 820 410 800 520
Features
  • Standard
  • For Thick Wafer
  • Standard
  • Less Strings Type
  • Low Chipping
  • For In-Line Process
  • For Thin Wafer (>100µm)
  • Low residue
  • For Metalized Wafer

(note) Data should be considered representative or typical only and should not be used for specification purposes.

FC Series for Package Dicing

Tape FC-217M-170 FC-224M-170 FC2127M-165 FS-8304-170
Backing Film Thickness (µm) 150 150 150 150
Adhesive Thickness (µm) 20 20 15 20
AdhesiveStrength (N/25mm) ♯280-SUS Before UV 6.7 6.2 8.3 4.7
After UV 0.4 0.4 0.7 0.5
Si-Wafer Before UV 6.6 4.8 8.6 5.5
After UV 0.3 0.3 0.5 0.3
Tensile Strength (N/10mm) MD 34 44 64 48
TD 32 42 62 46
Elongation (%) MD 790 340 770 650
TD 920 400 830 680
Features
  • Standard
  • Standard
  • Less Strings
  • Low Residue
  • Anti-ESD
    Before UV : 9E+10
    After UV : 5E+11

(note) Data should be considered representative or typical only and should not be used for specification purposes.

There line-up is typical product.

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