At Furukawa Electric, in addition to the forms already in the product lineup, we will attempt a wide range of forms based on the customer’s request.
Along with dielectric constant (Dk) and dissipation factor (Df), we will listen to the customer’s requests, such as fire resistance, heat resistance, thickness and density, and we will propose new materials utilizing our accumulated composition development capabilities and foam control technology.
Circuit boards
Match mold forming
Layering/ lamination/ forming
Bending
Cutting/ slicing
Please inquire about both forming and structure proposals!
We can also propose our other materials that match the requirements, such as heat resistance and strength.
“Smart Cellular Board” and “SCB” are registered Japanese trademarks of Furukawa Electric Co., Ltd.
Our SCB™ can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.