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Applications
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- High radio wave permeability
- Lightweight
- Plastic material that is simple to design (limit the frequency/ thickness dependency)
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Applications
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- Reduced transmission loss
- Limited heat generation
- Formability for printed circuit boards
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Characteristics
- Reflects infrared rays
- Limited radiant heat
“Smart Cellular Board” and “SCB” are registered Japanese trademarks of Furukawa Electric Co., Ltd.
Our SCB™ can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.