Low dielectric foam material｜Furukawa Electric Co., Ltd.

Through cellular foaming of engineering plastic and
super engineering plastic, achieved
Lightweight × Low dielectric

Lightweight
Low dielectric
Foam engineering
plastic

What is Smart Cellular Board™ (SCB™)

Proposals

Applications

Proposal for a radome material
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- High radio wave permeability
- Lightweight
- Plastic material that is simple to design (limit the frequency/ thickness dependency)
Applications

Proposal for a circuit board material
- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- Reduced transmission loss
- Limited heat generation
- Formability for printed circuit boards
Characteristics

Proposal of infrared ray reflective characteristics for reflecting solar heat
- Reflects infrared rays
- Limited radiant heat

Forming examples

At Furukawa Electric, we strive to achieve various forms in response to the customer’s requests.

Forming examples

News

List

2024.07.01
News Release

Development of “Smart Cellular Board™,” a low dielectric material for telecommunication base stations
- Promoting applications for radomes and substrates directed at realizing a Beyond 5G/6G society -
2024.05.20
Notice

Opened the low dielectric foam material website.

“Smart Cellular Board” and “SCB” are registered Japanese trademarks of Furukawa Electric Co., Ltd.

Our SCB™ can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.

Inquiries