Through cellular foaming of engineering plastic and super engineering plastic, achieved lightweight × low dielectric

Smart Cellular Board™ (hereinafter “SCB™”) is a cellular foamed, board type low dielectric material. Using our original foaming technology, it is possible to foam highly heat resistant plastics such as engineering plastic and super engineering plastic and obtain even lower dielectric properties than are achievable with typical low dielectric plastics.

Cellular foaming of engineering plastic and super engineering plastic

SCB™ realizes lightweight, low dielectric constant and low dissipation factor.

 As a material with low dielectric constant (Dk) and low dissipation factor (Df), when SCB™ is used as the material for circuit boards and radomes, it can solve issues including increased transmission loss and reduced radio wave permeability arising due to the use of higher frequencies within the telecommunications market as it shifts to 5G and 6G.

Specific gravity and dielectric characteristics of SCB™

Original technology used for SCB™

With our original batch foaming technology, which enables foaming below the melting point, it is possible to foam plastics with a high melting point (engineering plastic and super engineering plastic)!

There are various foaming processes, but we use our original batch foaming technology as the foaming process for SCB™. Through differences in the manufacturing process as described next, we are able to realize foaming below the melting point when the material is still in solid form.

Foaming processes

Chemical foaming

Temperature profile during molding

Cannot foam plastics with a melting point higher than the decomposition temperature of the foaming/ crosslinking agent

Difficult to foam engineering plastic and super engineering plastic with a high melting point

Batch foaming

Temperature profile during molding

Because gas permeation is done at room temperature and foaming is done below the melting point, it is possible to foam plastics with a high melting point

Possible to foam engineering plastic and super engineering plastic with a high melting point

Specification

Item Units SCB™-B1 SCB™-Z1 SCB™-Under development 1 SCB™-Under development 2
Base plastic   PET PP
Density g/cm3 0.23 0.33 0.29 0.18
Melting point 260 165 278
Tg 75 165 90
Coefficient of thermal expansion ppm/℃ 43
(-40~60℃)
60
(23℃~60℃)
50
(-20~100℃)
Tensile strength MPa 15.2 MD:12.2
TD:5.9
16.4 7
Tensile elongation % 70 MD:62
TD:90
7.5 50
Degree of crystallinity % 36.1 0 20
Dielectric characteristics Dielectric constant (Dk) 1.3 1.36 1.35 1.2
Dissipation factor (Df) 0.002 0.0001 0.0001 0.0005
Thickness mm 1.0 5.0 1.0 1.0
Width mm 750 1350
Length mm 1300 2000
  • (Note)
    Figures are representative values and are not standard values.
  • (Note)
    Dimensions are one example. Please inquire about other sizes.

Our SCB™ can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.