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Tape suitable for dicing a wide range of adherends.

Back-grinding tape that supports a wide variety of wafer types.

Tape for temporary retention and transport between processes.

Tape suitable for protecting wafer surfaces during acid etching and heating processes.

Tape with high transmittance and dicing performance.

Die Attach Film is adhesive film which is used for semiconductor process.

It is combined with dicing tape, and it is called as Dicing Die Attach Film.

Back-grinding tape that supports wafers with bumps up to 250 μm in height.

Our conductive dicing die attach film has electrical/thermal conductivity to resolve issues with packages, which continue to become thinner and more compact.