Introduction of New Product, New Technology, and Technical Data
New Product, New Technology
Conductive Dicing Die Attach Film (C-DAF)
As the solution of heat release for small and thin package, we are developing conductive die attach film.
Backgrinding Tape for High-bumped WaferFor backgrinding of high-bumped wafer, we are developing new tape.
Backgrinding Tape for SDBG/GAL Process
SDBG (Stealth Dicing Before Grinding) and GAL (Grinding After Laser) process is recommended to achieve thin wafer. For the SDBG/GAL process, we are developing new tape.
What is UV Tape ?
UV tape have strong adhesive strength. Then, tape holds wafer strongly in wafer grinding process or wafer dicing process.