Our products provide both high coverage and TTV performance for wafer with high bump.
Features
- Includes an intermediate resin layer for excellent bump coverage up to height 250 μm
- High TTV performance
- Selectivity of UV and non-UV type
Characteristics
Tape | SP-537T-230 | SP-544T-265 | SP5207M-425 | CP9206M-430 | ||
---|---|---|---|---|---|---|
Backing Film Thickness (µm) | 100 | 100 | 420 | 420 | ||
Adhesive Thickness (µm) | 130 | 165 | 5 | 10 | ||
Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 6.4 | 7.2 | 0.4 | 0.3 |
After UV | 0.8 | 0.5 | 0.3 | - | ||
Si-Wafer | Before UV | 2.5 | 5.9 | 0.2 | NA | |
After UV | 0.1 | 0.4 | 0.1 | - | ||
Features |
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(note)Data shown above are typical values and not guaranteed values.
Suitable applications
![](images/backgrinding_fig01.png)
Details of back-grinding tape for high bump
Material
The intermediate resin layer and adhesive layer are combined which have good performance of bump coverage and peeling both.
Tape | SP5207M-425 | CP9206M-430 | |||
---|---|---|---|---|---|
Material | Backing film | Polyester | ![]() |
Polyester |
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Intermediate resin | Polyolefin | Polyolefin | |||
Adhesive | Acrylic (UV Type) |
Acrylic (Non-UV type) |
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Release Film | Polypropylene | Polypropylene | |||
Thickness (μm) |
Backing film | 50 | 50 | ||
Intermediate resin | 370 | 370 | |||
Adhesive | 5 | 10 | |||
Total thickness | 425 | 430 | |||
Recommended UV dosage (mJ/cm2) |
500 | - | |||
Recommended lamination temperature (℃) |
70 | 70 |
(note)Data shown above are typical values and not guaranteed values.
Bump coverage after tape lamination
Our Back-Grinding tape for high bump shows good bump coverage performance.
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Standard tape
Floating = poor bump coverage
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Back-grinding tape for high bump
No floating = excellent bump coverage
TTV performance
High wafer TTV performance after back-grinding is achieved by excellent tape TTV.
Tape TTV
![](images/bump_fig03-1.png)
![](images/bump_fig03-2.png)
![](images/bump_fig03-3.png)
(note)Data shown above are typical values and not guaranteed values.
The good wafer TTV performance caused by excellent tape TTV performance.
![](images/bump_fig04-1.png)
![](images/bump_fig04-2.png)
![](images/bump_fig04-3.png)
(note)Data shown above are typical values and not guaranteed values.
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