Our products provide both high coverage and TTV performance for wafer with high bump.
Features
- Includes an intermediate resin layer for excellent bump coverage up to height 250 μm
- High TTV performance
- Selectivity of UV and non-UV type
Characteristics
Tape | SP-537T-230 | SP-544T-265 | SP5207M-425 | CP9206M-430 | ||
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Backing Film Thickness (µm) | 100 | 100 | 420 | 420 | ||
Adhesive Thickness (µm) | 130 | 165 | 5 | 10 | ||
Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 6.4 | 7.2 | 0.4 | 0.3 |
After UV | 0.8 | 0.5 | 0.3 | - | ||
Si-Wafer | Before UV | 2.5 | 5.9 | 0.2 | NA | |
After UV | 0.1 | 0.4 | 0.1 | - | ||
Features |
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(note)Data shown above are typical values and not guaranteed values.
Suitable applications

Details of back-grinding tape for high bump
Material
The intermediate resin layer and adhesive layer are combined which have good performance of bump coverage and peeling both.
Tape | SP5207M-425 | CP9206M-430 | |||
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Material | Backing film | Polyester | ![]() |
Polyester |
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Intermediate resin | Polyolefin | Polyolefin | |||
Adhesive | Acrylic (UV Type) |
Acrylic (Non-UV type) |
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Release Film | Polypropylene | Polypropylene | |||
Thickness (μm) |
Backing film | 50 | 50 | ||
Intermediate resin | 370 | 370 | |||
Adhesive | 5 | 10 | |||
Total thickness | 425 | 430 | |||
Recommended UV dosage (mJ/cm2) |
500 | - | |||
Recommended lamination temperature (℃) |
70 | 70 |
(note)Data shown above are typical values and not guaranteed values.
Bump coverage after tape lamination
Our Back-Grinding tape for high bump shows good bump coverage performance.
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Standard tape
Floating = poor bump coverage
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Back-grinding tape for high bump
No floating = excellent bump coverage
TTV performance
High wafer TTV performance after back-grinding is achieved by excellent tape TTV.
Tape TTV



(note)Data shown above are typical values and not guaranteed values.
The good wafer TTV performance caused by excellent tape TTV performance.



(note)Data shown above are typical values and not guaranteed values.
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