For backgrinding of high-bumped wafer, we are developing new tape. It has not only excellent covering performance, and also easy peeling performance from high-bumped wafer.
Applicable to 200μm height bump with excellent covering performance
Easy peeling from high-bumped wafer
Easy handling, since it’s no need to heat in peeling process
Picture after taping
Floating of tape is observed
New Developing Tape
Excellent covering performance without floating
Adhesive Strength between Tape and Wafer with Each Bump Height
New developing tape keeps lower adhesive strength for bumped wafer
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