Our products provide both high coverage and TTV performance for wafer with high bump.

Features

Characteristics

Tape SP-537T-230 SP-544T-265 SP5207M-425 CP9206M-430
Backing Film Thickness (µm) 100 100 420 420
Adhesive Thickness (µm) 130 165 5 10
Adhesive Strength
(N/25mm)
♯280-SUS Before UV 6.4 7.2 0.4 0.3
After UV 0.8 0.5 0.3 -
Si-Wafer Before UV 2.5 5.9 0.2 NA
After UV 0.1 0.4 0.1 -
Features
  • Support for low bumps
    (up to 60 μm)
  • UV Type
  • Support for low bumps
    (up to 80 μm)
  • UV Type
  • Support for high bumps
    (up to 250 μm)
  • UV Type
  • Support for high bumps
    (up to 250 μm)
  • Non-UV type

(note)Data shown above are typical values and not guaranteed values.

Suitable applications

Details of back-grinding tape for high bump

Material

The intermediate resin layer and adhesive layer are combined which have good performance of bump coverage and peeling both.

Tape SP5207M-425 CP9206M-430
Material Backing film Polyester
Polyester
Intermediate resin Polyolefin Polyolefin
Adhesive Acrylic
(UV Type)
Acrylic
(Non-UV type)
Release Film Polypropylene Polypropylene
Thickness
(μm)
Backing film 50 50
Intermediate resin 370 370
Adhesive 5 10
Total thickness 425 430
Recommended UV dosage
(mJ/cm2)
500 -
Recommended lamination temperature
(℃)
70 70

(note)Data shown above are typical values and not guaranteed values.

Bump coverage after tape lamination

Our Back-Grinding tape for high bump shows good bump coverage performance.

TTV performance

High wafer TTV performance after back-grinding is achieved by excellent tape TTV.

Tape TTV

CP9206M-430

SP5207M-425

Conventional products

(note)Data shown above are typical values and not guaranteed values.

The good wafer TTV performance caused by excellent tape TTV performance.

CP9206M-430

SP5207M-425

Conventional products

(note)Data shown above are typical values and not guaranteed values.

Click here for inquiries.