SDBG (Stealth Dicing Before Grinding) and GAL (Grinding After Laser) process is recommended to achieve thin wafer. For the SDBG/GAL process, we are developing new tape.
Feature
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Less chip cracks with special backing film
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Excellent TTV performance
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Preventing kerf shift in chip breaking stage
Process Flow of SDBG/GAL
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Tape Lamination
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Stealth Dicing
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Chip is divided in grinding process
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Mount of dicing die attach film
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Tape removal
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