Our adhesive film is capable of transferring heat or electricity.
Developed using our polymer mixing and sheet manufacturing technologies, our electrically/thermally conductive dicing die attach film (C-DAF) is mixed with a special filler and continues to attract attention as a means to solve issues with heat dissipation in packages for 5G/IoT applications.
What is C-DAF?
Advantages of C-DAF
- Excellent bleed out control
- Excellent BLT(bond line thickness) control
- Less void
Features
- By applying C-DAF, it is possible to reduce the thermal resistance in the package.
- For devices that has thermal constraints such as application processors, logic, PIM（Processing in memory）, and power devices, we recommend a high thermal conductive type of 10 W/m*K or higher.
- If electrical insulation is required, such as for stacking in memory devices, we can propose C-DAF that does not have electric conductivity.
- We are developing a wide lineup of thicknesses from 5um to 80um or more thicker one.
- High reliability can be achieved by using an appropriate epoxy resin.
- Our C-DAF is also called as high thermal conductive epoxy film because it’s based on epoxy resin.
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