Our adhesive film is capable of transferring heat or electricity.

Developed using our polymer mixing and sheet manufacturing technologies, our electrically/thermally conductive dicing die attach film (C-DAF) is mixed with a special filler and continues to attract attention as a means to solve issues with heat dissipation in packages for 5G/IoT applications.

What is C-DAF?

Advantages of C-DAF


Click here for inquiries.