This protection tape has high resistance on acid and heat process.
Features
- No seepage, high acid resisting
- Bear with 150℃ TEMP
Characteristics
Protection tape for acid
Tape | SP-594M-130 | SP-537T-160 | CP9003B-205B | ||
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Backing Film Thickness (µm) | 100 | 100 | 165 | ||
Adhesive Thickness (µm) | 30 | 60 | 40 | ||
Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 7.9 | 4.1 | 1.8 |
After UV | 0.1 | 1.0 | - | ||
Si-Wafer | Before UV | 3.0 | 1.5 | NA | |
After UV | 0.1 | 0.1 | - | ||
Features |
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(note)Data shown above are typical values and not guaranteed values.
Heat process
Tape | SP6002T-115 | SP6101T-40 | ||
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Backing Film Thickness (µm) | 75 | 25 | ||
Adhesive Thickness (µm) | 40 | 15 | ||
Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 6.0 | 1.4 |
After UV | 0.3 | 0.1 | ||
Si-Wafer | Before UV | 2.5 | 1.1 | |
After UV | 0.1 | 0.1 | ||
Features |
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(note) Does not support back-grinding processes |
(note)Data shown above are typical values and not guaranteed values.
Process
![](images/surface-hold_fig01.png)
Change in adhesive strength due to heat
Good stability in heat process.
![](images/surface-hold_graph01.png)
(note)Data shown above are typical values and not guaranteed values.
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