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Structure of Tape for Semiconductor Process

Tape have a two-ply construction of backing film and adhesive layer. And the surface of the adhesive layer is covered with a release film.

Mainly, backing film is made of Polyolefin. However that, other material is used for backing film depending on the situation. About adhesive, it is made of Acrylic. And Release film is made by PET.

Propose Tape for Backgrinding Tape for Dicing
Wafer Dicing Package Dicing
Tape SP Series CP Series UC Series FC Series
Features UV Type Non-UV Type UV Type UV Type
Release Film PET



Adhesive Acrylic Acrylic Acrylic Acrylic
Backing Film Polyolefin Polyolefin Polyolefin Polyolefin

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