We are supporting front line of semiconductor industry with Advanced Tape and Advanced Film Technology.
Tape for Backgrinding
These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
Tape for Dicing
These tapes are designed for holding semiconductor wafer or package during dicing process.
Dicing Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process.
It is combined with dicing tape, and it is called as Dicing Die Attach Film.
Structure of Tape for Semiconductor Process
Tape have a two-ply construction of backing film and adhesive layer. And the surface of the adhesive layer is covered with a release film.
Mainly, backing film is made of Polyolefin. However that, other material is used for backing film depending on the situation. About adhesive, it is made of Acrylic. And Release film is made by PET.
|Propose||Tape for Backgrinding||Tape for Dicing|
|Wafer Dicing||Package Dicing|
|Tape||SP Series||CP Series||UC Series||FC Series|
|Features||UV Type||Non-UV Type||UV Type||UV Type|
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