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Tape for Backgrinding
These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
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Tape for Dicing
These tapes are designed for holding semiconductor wafer or package during dicing process.
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Dicing Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process.
It is combined with dicing tape, and it is called as Dicing Die Attach Film.
Structure of Tape for Semiconductor Process
Tape consists of backing film and adhesive layer, and the surface of the adhesive layer is covered with a release film.
Backing film, adhesive layer, and release film are mainly made of polyolefin, acrylic adhesive and PET, respectively.
| Propose | Tape for Backgrinding | Tape for Dicing | ||
|---|---|---|---|---|
| Tape | SP Series | CP Series | UC Series | FC Series |
| Features | UV Type | Non-UV Type | UV Type | UV Type |
| Release Film | PET | PET Polypropylene |
PET | PET |
| Adhesive | Acrylic | Acrylic | Acrylic | Acrylic |
| Backing Film | Polyolefin | Polyolefin | Polyolefin | Polyolefin |
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