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Structure of Tape for Semiconductor Process

Tape consists of backing film and adhesive layer, and the surface of the adhesive layer is covered with a release film.

Backing film, adhesive layer, and release film are mainly made of polyolefin, acrylic adhesive and PET, respectively.

Propose Tape for Backgrinding Tape for Dicing
Tape SP Series CP Series UC Series FC Series
Features UV Type Non-UV Type UV Type UV Type
Release Film PET



Adhesive Acrylic Acrylic Acrylic Acrylic
Backing Film Polyolefin Polyolefin Polyolefin Polyolefin

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