This is protection tape for circuit of semiconductor wafer surface in back grinding process.
Feature
- Suitable for thin wafer grinding caused by stress relaxation
- Good for detaping
- Suitable for various device
Tape for Backgrinding
| Tape | SP Series | CP Series |
|---|---|---|
| Features | UV Type | Non-UV Type |
| Release Film | PET | PET Polypropylene |
| Adhesive | Acrylic | Acrylic |
| Backing Film | Polyolefin | Polyolefin |
Characteristics (Main Products)
SP Series for silicon wafers
| Tape | SP-594M- 130 |
SP5156B- 130 |
SP-541B- 205 |
SP-537T- 230 |
SP5207M- 425 |
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|---|---|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 100 | 110 | 165 | 100 | 420 | ||
| Adhesive Thickness (µm) | 30 | 20 | 40 | 130 | 5 | ||
| Adhesive Strength (N/25mm) |
♯280-SUS | Before UV | 7.9 | 1.3 | 2.6 | 6.4 | 0.4 |
| After UV | 0.1 | 0.3 | 0.5 | 0.8 | 0.3 | ||
| Si-Wafer | Before UV | 3.0 | 0.5 | 1.7 | 2.5 | 0.2 | |
| After UV | 0.1 | 0.1 | 0.2 | 0.1 | 0.1 | ||
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(note)Data shown above are typical values and not guaranteed values.
CP Series for silicon wafers
| Tape | CP9007B-130 | CP9003B-205B | CP9079B-200 | CP9206M-430 | |
|---|---|---|---|---|---|
| Backing Film Thickness (µm) | 100 | 165 | 165 | 420 | |
| Adhesive Thickness (µm) | 30 | 40 | 35 | 10 | |
| Adhesive Strength (N/25mm) |
♯280- SUS |
0.9 | 1.8 | 0.5 | 0.3 |
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(note)Data shown above are typical values and not guaranteed values.
Introduction to Other Products
Furukawa Electric products are suited to a variety of applications.
We will introduce much suitable tape to your process, Just inform us device/application and specification.
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