This tape is used to hold semiconductor wafer during dicing/singulation process.


Tape for Dicing

Tape Wafer Dicing
UC Series
Package Dicing
FC Series
Features UV Type UV Type
Release Film PET


Adhesive Acrylic Acrylic
Backing Film Polyolefin Polyolefin

Characteristics (Main Products)

UC Series for Compound wafer

Tape UC3044M-110E UC3044M-110B UC3139M-85 UC-334EP-85
Backing Film Thickness (µm) 100 100 80 80
Adhesive Thickness (µm) 10 10 5 5
Adhesive Strength
♯280-SUS Before UV 5.1 2.5 4.9 1.5
After UV 0.3 0.2 0.5 0.3
Si-Wafer Before UV 1.8 1.1 2.2 1.1
After UV 0.1 0.1 0.1 0.2
Features Less chipping Less chipping Suitable for thin wafers Suitable for back side metal

(note)Data shown above are typical values and not guaranteed values.

FC Series for Package Dicing

Tape FC2127M-165 FC-224M-170 FS-8304-170
Backing Film Thickness (µm) 150 150 150
Adhesive Thickness (µm) 15 20 20
♯280-SUS Before UV 8.3 6.1 4.9
After UV 0.7 0.4 0.5
Si-Wafer Before UV 8.9 5.2 5.5
After UV 0.5 0.3 0.3
Features Suitable for small-sized package Less/no whisker Antistatic

(note)Data shown above are typical values and not guaranteed values.

Introduction to Other Products

Furukawa Electric products are suited to a variety of applications.

We will introduce much suitable tape to your process, Just inform us device/application and specification.

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