Tape for Semiconductor Process
of Furukawa Electric
We keep challenging to make new products, new technologies, and new manufacturing methods.
We offer you the best solution for your needs with all our technologies.
Unique abilities to design, develop and manufacture each layers by ourselves
From 2014, DAF production line was installed newly. As the result, Furukawa acquired unique abilities to design, develop and manufacture each layers by ourselves.
History
We have continued our business since 1984 and we have launched various kind of dicing tape and grinding tape with own knowhow.
| 1984 | Started the Development in Hiratsuka Works |
|---|---|
| 1987 | Dicing Tape UC Series is Launched |
| 1988 | Backgrinding Tape SP Series is Launched |
| 1993 | Backgrinding Tape CP Series is Launched |
| 1999 | Dicing Tape FC Series is Launched |
| 2007 | Mie Works Starts Operation |
| 2014 | Dicing Die Attach Film is Lunched |
Products
Tape for Backgrinding
These tapes are designed for surface protection of semiconductor wafers during backgrinding process.
Tape for Dicing
These tapes are designed for holding semiconductor wafer or package during dicing process.
Dicing Die Attach Film
Die Attach Film is adhesive film which is used for semiconductor process.
It is combined with dicing tape, and it is called as Dicing Die Attach Film.
