Special Issue on Thermal Solution Technologies
Opening Remarks | ||
Special Issue Featuring Thermal Solutions -- Moving Heat toward the Future -- | ![]() |
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Elemental Technologies | ||
Steady and Transient Heat Transfer Characteristics of Flat Micro Heatpipe | Abstract | ![]() |
Development of High-Power Large-Sized Peltier Module | Abstract | ![]() |
Applied Technologies | ||
Development of High-Performance Heatsink "Crimped fin" | Abstract | ![]() |
Development of Heatpipe-Based Remote Heatsinks for Desktop PCs | Abstract | ![]() |
Evolution of the Heatsink Technology | Abstract | ![]() |
Environment-Friendly Vertical Air-Cooling Heatsink: Heatpipe-Based Heatsink "POWER KICKER" | Abstract | ![]() |
Development of Thermal Products Using the EB Method | Abstract | ![]() |
Development of High-Speed Pb-Free Reflow Ovens | Abstract | ![]() |
Software and Patent Technologies | ||
Applications of Computational Thermal Simulation in Product Design | Abstract | ![]() |
Thermal Design Simulation Software "HIEROH" | Abstract | ![]() |
Thermal Design Tool for Vehicle Electric Parts | Abstract | ![]() |
Trends in State-of-the-Art Heatsinks and Their Patent Technology | Abstract | ![]() |
Regular Papers
A 4.25-Gbps Transmitter Optical Sub-Assembly (TOSA) Using an 850-nm Vertical-Cavity Surface-Emitting Laser (VCSEL) | Abstract | ![]() |
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1.3-µm Range Vertical-Cavity Surface-Emitting Laser (VCSEL) Module | Abstract | ![]() |
Topics
Introduction to Furukawa AVC Electronics (Suzhou) | ![]() |
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New Products
Lineup Expansion of Non-Silicone Thermally Conductive Sheet "F-CO TM Sheet" | ![]() |
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Electromagnetic Wave Absorbing Sheet "F-CO TM Sheet EMI" | ![]() |
Practical Application of the World's Lowest-Profiled Heatsink | ![]() |
A Compact Lightweight Heat-Dissipating Cabinet | ![]() |