Special Issue on Thermal Solution Technologies
| Opening Remarks | ||
| Special Issue Featuring Thermal Solutions -- Moving Heat toward the Future -- | ||
|---|---|---|
| Elemental Technologies | ||
| Steady and Transient Heat Transfer Characteristics of Flat Micro Heatpipe | Abstract | |
| Development of High-Power Large-Sized Peltier Module | Abstract | |
| Applied Technologies | ||
| Development of High-Performance Heatsink "Crimped fin" | Abstract | |
| Development of Heatpipe-Based Remote Heatsinks for Desktop PCs | Abstract | |
| Evolution of the Heatsink Technology | Abstract | |
| Environment-Friendly Vertical Air-Cooling Heatsink: Heatpipe-Based Heatsink "POWER KICKER" | Abstract | |
| Development of Thermal Products Using the EB Method | Abstract | |
| Development of High-Speed Pb-Free Reflow Ovens | Abstract | |
| Software and Patent Technologies | ||
| Applications of Computational Thermal Simulation in Product Design | Abstract | |
| Thermal Design Simulation Software "HIEROH" | Abstract | |
| Thermal Design Tool for Vehicle Electric Parts | Abstract | |
| Trends in State-of-the-Art Heatsinks and Their Patent Technology | Abstract | |
Regular Papers
| A 4.25-Gbps Transmitter Optical Sub-Assembly (TOSA) Using an 850-nm Vertical-Cavity Surface-Emitting Laser (VCSEL) | Abstract | |
|---|---|---|
| 1.3-µm Range Vertical-Cavity Surface-Emitting Laser (VCSEL) Module | Abstract |
Topics
| Introduction to Furukawa AVC Electronics (Suzhou) |
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New Products
| Lineup Expansion of Non-Silicone Thermally Conductive Sheet "F-CO TM Sheet" | |
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| Electromagnetic Wave Absorbing Sheet "F-CO TM Sheet EMI" | |
| Practical Application of the World's Lowest-Profiled Heatsink | |
| A Compact Lightweight Heat-Dissipating Cabinet |