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Applications
Proposal for a radome material- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- High radio wave permeability
- Lightweight
- Plastic material that is simple to design (limit the frequency/ thickness dependency)
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Applications
Proposal for a circuit board material- Low dielectric constant (Dk)
- Low dissipation factor (Df)
- Reduced transmission loss
- Limited heat generation
- Formability for printed circuit boards
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Characteristics
Proposal of infrared ray reflective characteristics for reflecting solar heat- Reflects infrared rays
- Limited radiant heat
News
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News ReleaseDevelopment of “Smart Cellular Board™,” a low dielectric material for telecommunication base stations
- Promoting applications for radomes and substrates directed at realizing a Beyond 5G/6G society - -
NoticeOpened the low dielectric foam material website.
“Smart Cellular Board” and “SCB” are registered Japanese trademarks of Furukawa Electric Co., Ltd.
Our SCB can solve the issues often faced when designing base stations that use high frequency radio waves in 5G/ Beyond 5G/ 6G telecommunications.