By applying the roughening treatment to the smooth shiny surface, while it is low cost, it has excellent high-frequency response. (Manufactured in Taiwan.)

Feature

  • By smoothening the electrolytic drum surface, the superior high-frequency response than the conventional RTF was obtained.

Typical application

  • Information communication equipment such as the router and the server.

Specification

DGTSEU2-MP

Foil thickness [µm] 12

18

35
Tensile strength [MPa] 340 320 300
Elongation [%] 9 12 20
Surface roughness Rz [µm] 3

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105～
High-frequency substrate

DGTSEU2-MP

 RTF Taiwan 　 　 ○ ○ ○ 　 　

FT2-UP

 VLP Taiwan 　 　 　 ○ ○ 　 　

FT1-UP

 H-VLP Taiwan 　 　 　 ○ ○ 　 　

FV/FHG-WS

 H-VLP Japan 　 　 ○ ○ ○ 　 　

FZ-WS

 H-VLP2 Japan 　 　 ○ ○ ○ 　 　
Flexible printed circuit boards

F2-WS

 VLP Japan 　 ○ ○ ○ ○ 　 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

FWL-WS

 VLP Japan 　 　 ○ ○   　 　
Package substrate

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
High-density multi-layer circuit board

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
Large-current substrate

GTS-STD

 Standard foil Japan 　 　 　 　 　 　 ○(～210μm)

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