Excellent in the resin adhesion and in the circuit linearity by applying the uniform and dense roughening treatment.

In the F-WS series, multiple types are lineup according to the roughening treatment level, and the adhesion with resin base materials, such as FPC, a package or rigid substrate, in any applications.

Feature

  • The low roughening treatment, capable of a fine pattern, is also excellent in the adhesion.
  • Recognized in the global market as the electrodeposited copper foil for the two-layered FPC, and it boasts trust and achievements.
  • The width in meters is available.

Typical application

  • Flexible substrate
  • Package substrate

Specification

F0-WS

Foil thickness [µm] 12

18

35
Tensile strength [MPa] 310 310 310
Elongation [%] 7 9 19
Surface roughness Rz [μm] 1.4 1.2 1.2

F2-WS

Foil thickness [µm] 9

12

18

 35
Tensile strength [MPa] 310 310 310 310
Elongation [%] 4 7 9 19
Surface roughness Rz [μm] 1.8 1.8 1.8 1.3

F3-WS

Foil thickness [µm] 12 70
Tensile strength [MPa] 310 310
Elongation [%] 7 29
Surface roughness Rz [μm] 3.1 2.6

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105～
High-frequency substrate

DGTSEU2-MP

 RTF Taiwan 　 　 ○ ○ ○ 　 　

FT2-UP

 VLP Taiwan 　 　 　 ○ ○ 　 　

FT1-UP

 H-VLP Taiwan 　 　 　 ○ ○ 　 　

FV/FHG-WS

 H-VLP Japan 　 　 ○ ○ ○ 　 　

FZ-WS

 H-VLP2 Japan 　 　 ○ ○ ○ 　 　
Flexible printed circuit boards

F2-WS

 VLP Japan 　 ○ ○ ○ ○ 　 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

FWL-WS

 VLP Japan 　 　 ○ ○   　 　
Package substrate

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
High-density multi-layer circuit board

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
Large-current substrate

GTS-STD

 Standard foil Japan 　 　 　 　 　 　 ○(～210μm)

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