High adhesion is achieved even to hard base materials such as LCP.

Feature

  • Provides high adhesion strength for liquid crystal polymer (LCP) backing layers, which offer superior high-frequency characteristics.

Typical application

  • Liquid crystal polymer resin base material
  • Package substrate

Specification

FWL-WS

Foil thickness [µm] 12

18
Tensile strength [MPa] 310 310
Elongation [%] 7 9
Surface roughness Rz [µm] 2.3 2.0

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105～
High-frequency substrate

DGTSEU2-MP

 RTF Taiwan 　 　 ○ ○ ○ 　 　

FT2-UP

 VLP Taiwan 　 　 　 ○ ○ 　 　

FT1-UP

 H-VLP Taiwan 　 　 　 ○ ○ 　 　

FV/FHG-WS

 H-VLP Japan 　 　 ○ ○ ○ 　 　

FZ-WS

 H-VLP2 Japan 　 　 ○ ○ ○ 　 　
Flexible printed circuit boards

F2-WS

 VLP Japan 　 ○ ○ ○ ○ 　 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

FWL-WS

 VLP Japan 　 　 ○ ○   　 　
Package substrate

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
High-density multi-layer circuit board

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
Large-current substrate

GTS-STD

 Standard foil Japan 　 　 　 　 　 　 ○(～210μm)

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