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FT-UP

FT1-UP
・Copper foil for high-end high-frequency circuit boards
・H-VLP

While it is low cost, the high-frequency response at H-VLP level is realized. (Manufactured in Taiwan.)

Feature

Taking advantage of Japanese H-VLP manufacturing technology, the low cost H-VLP is provided.
Excellent in the high-frequency response and high both in the adhesion and in the heat resistance are the feature.

Typical application

Flexible substrate
Information communication equipment such as the router and the server.

FT2-UP
・Copper foil for packaged and high-frequency circuit boards
・VLP

特長

The low cost VLP foil, taking advantage of Japanese F-WS manufacturing technology.
The surface is treated with a greater focus on adhesion than even that of FT1 (H-VLP foil).

Typical application

Flexible substrate
Package substrate

Specification

FT1-UP

Foil thickness [µm]	18	35
Tensile strength [MPa]	320	320
Elongation [%]	15	20
Surface roughness Rz [μm]	1.4	0.9

FT2-UP

Foil thickness [µm]	18	35
Tensile strength [MPa]	320	320
Elongation [%]	15	20
Surface roughness Rz [μm]	1.7	1.3

Copper foil list by application

Application	Type	Profile	Manufacturing location	Thickness (μm)
Application	Type	Profile	Manufacturing location	6	9	12	18	35	70	105～
High-frequency substrate	DGTSEU2-MP	RTF	Taiwan			○	○	○
	FT2-UP	VLP	Taiwan				○	○
	FT1-UP	H-VLP	Taiwan				○	○
	FV/FHG-WS	H-VLP	Japan			○	○	○
	FZ-WS	H-VLP2	Japan			○	○	○
Flexible printed circuit boards	F2-WS	VLP	Japan		○	○	○	○
	F3-WS	VLP	Japan			○			○
	FWL-WS	VLP	Japan			○	○
Package substrate	GTS-MP	Standard foil	Taiwan			○	○	○	○
	F3-WS	VLP	Japan			○			○
	DF-TSH	VLP	Japan	○	○
High-density multi-layer circuit board	GTS-MP	Standard foil	Taiwan			○	○	○	○
High-density multi-layer circuit board	DF-TSH	VLP	Japan	○	○
Large-current substrate	GTS-STD	Standard foil	Japan							○(～210μm)