By applying the fine-roughening treatment, both the resin adhesion and the high-frequency response, which are in the trade off relation, are at high levels.

Feature

  • Both surfaces smooth foil is subjected to the fine roughening surface treatment, and the required performances (low transmission loss, adhesion to a resin base material and heat resistance) are balanced at high levels.

Typical application

  • Information communication equipment such as the high-end router and the server.
  • Substrate for an antenna in a communication base station

Specification

FV(FHG)-WS

Foil thickness [µm] 12

18

35
Tensile strength [MPa] 310 310 310
Elongation [%] 7 9 19
Surface roughness Rz [μm] 1.4 1.2 1.2

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105～
High-frequency substrate

DGTSEU2-MP

 RTF Taiwan 　 　 ○ ○ ○ 　 　

FT2-UP

 VLP Taiwan 　 　 　 ○ ○ 　 　

FT1-UP

 H-VLP Taiwan 　 　 　 ○ ○ 　 　

FV/FHG-WS

 H-VLP Japan 　 　 ○ ○ ○ 　 　

FZ-WS

 H-VLP2 Japan 　 　 ○ ○ ○ 　 　
Flexible printed circuit boards

F2-WS

 VLP Japan 　 ○ ○ ○ ○ 　 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

FWL-WS

 VLP Japan 　 　 ○ ○   　 　
Package substrate

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

F3-WS

 VLP Japan 　 　 ○     ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
High-density multi-layer circuit board

GTS-MP

 Standard foil Taiwan 　 　 ○ ○ ○ ○ 　

DF-TSH

 VLP Japan ○ ○ 　 　 　 　 　
Large-current substrate

GTS-STD

 Standard foil Japan 　 　 　 　 　 　 ○(～210μm)

Top of Page