Our typical surface treatment, applicable to the various resin base materials. (GTS-MP is manufactured in Taiwan.)

Feature

  • GTS-STD
    The general copper foil compatible with Grade 1 of the IPC-4562 standard.
  • GTS-MP
    Our typical general middle-profile foil compatible with Grade 2 and 3 of IPC-4562 standard.

Typical application

  • Multi-layered substrate
  • High-density multi-layer circuit board

  • Package substrate

  • Large-current substrate

Specification

GTS-STD

Foil thickness [µm] 105 140 175 210
Tensile strength [MPa] 290 280 270 270
Elongation [%] 7 8 8 8
Surface roughness Rz [µm] 16 17 17 17

GTS-MP

Foil thickness [µm] 12 18 35 70
Tensile strength [MPa] 340 320 300 270
Elongation [%] 9 12 20 33
Surface roughness Rz [µm] 7 8 10 13

Copper foil list by application

Application Type Profile Manufacturing location Thickness (μm)
6 9 12 18 35 70 105~
High-frequency substrate RTF Taiwan        
VLP Taiwan          
H-VLP Taiwan          
H-VLP Japan        
H-VLP2 Japan        
Flexible printed circuit boards VLP Japan      
VLP Japan          
VLP Japan          
Package substrate Standard foil Taiwan      
VLP Japan          
VLP Japan          
High-density multi-layer circuit board Standard foil Taiwan      
VLP Japan          
Large-current substrate Standard foil Japan             ○(~210μm)