Semiconductor tape is mainly used in processing semiconductor wafers made from materials such as silicon or glass. Its powerful adhesive strength keeps wafers in place when grinding and cutting. Once the wafer has been processed, exposing the tape to ultraviolet light (UV) reduces its adhesive strength, making tape peeling or die pick up simple.
Furukawa Electric also carries dicing die attach film—which combines dicing tape with die attach film used to attach semiconductor chips to substrates and other objects—and continues to earn the praise and trust of customers with its technologies that enable the design, development, and manufacturing of proprietary “die attach film, adhesive, and backing layers.”

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