Participating in "JOINT3" Consortium to Develop Next-Generation Semiconductor Packaging
Furukawa Electric Co., Ltd. (Head office: 2-6-4 Otemachi, Chiyoda-ku, Tokyo; President: Hideya Moridaira) has joined "JOINT3" consortium to develop next-generation semiconductor packaging.
JOINT3 is a co-creation evaluation framework established by Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) with the aim of accelerating the development of materials, equipment, and design tools optimized for panel-level organic interposers through collaboration among material, equipment, and design companies. JOINT3 brings together global leaders in semiconductor supply chain. Using a prototype line for 515 x 510mm panel-level organic interposers, the consortium promotes the development of materials, equipment, and design tools optimized for panel-level organic interposers.
In recent years, packaging for back-end processes has emerged as a key technology in the field of next-generation semiconductors. This includes 2.xD packages, whereby multiple semiconductor chips are arranged in parallel and connected via interposers, demand for which is expected to grow in line with the need for increased data communication capacity and speed. As semiconductor performance improves, interposers are becoming larger, and there is a shift from silicon interposers to organic interposers made from organic materials.
Conventional manufacturing methods involve cutting rectangular pieces from circular wafers. However, as interposers increase in size, the number of them that can be obtained from a single wafer decreases, posing a significant challenge. To address this issue, a manufacturing process that transitions from circular wafer shapes to square panel shapes is gaining attention, as it allows for an increased number of interposers to be produced from a given area of wafer.
In JOINT3, through co-creation with fellow participating companies, we aim to further enhance our technological capabilities, take on the challenge of innovating next-generation semiconductor packaging technologies, and contribute to the development of the semiconductor industry.
Overview of JOINT3
| Name | JOINT3 (JOINT:Jisso Open Innovation Network of Tops) |
|---|---|
| Objectives | Accelerate the development of materials, equipment, and design tools optimized for panel-level organic interposers through co-creation with participating companies. |
| Participating Companies (listed in alphabetical order) |
27 companies (as of September 3, 2025) Resonac Corporation, AGC Inc., Applied Materials, Inc., ASMPT, Brewer Science, Inc., Canon Inc., Comet Yxlon GmbH, EBARA Corporation, Furukawa Electric Co., Ltd., Hitachi High-Tech Corporation, JX Advanced Metals Corporation, Kao Corporation, Lam Research Corporation, LINTEC Corporation, MEC COMPANY LTD., Mitutoyo Corporation, NAMICS Corporation, Nikko-Materials Co., Ltd., OKUNO CHEMICAL INDUSTRIES CO., LTD., Synopsys, Inc., Tokyo Electron Ltd., Tokyo Ohka Kogyo Co., Ltd., TOWA Corporation, ULVAC, Inc., Ushio Inc., ZUKEN Inc., 3M Company |
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Furukawa Electric Group’s efforts towards the SDGs
Based on the “Sustainable Development Goals (SDGs)” adopted by the United Nations, Furukawa Electric Group has formulated the “Furukawa Electric Group Vision 2030” which sets the year 2030 as its target and is advancing efforts with the aim to “Build a sustainable world and make people’s life safe, peaceful and rewarding, Furukawa Electric Group will create solutions for the new generation of global infrastructure combining information, energy and mobility.” Toward the achievement of our Vision 2030, we will take open, agile, and innovative approaches to promote ESG management that aims to increase corporate value over the medium to long term and will contribute to the achievement of the SDGs.
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